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Aluminum nitride ceramic plates are mainly with aluminum nitride (AIN) as the main crystal phase, and the chemical composition of them is usually AI 65%, N 35%. The specific gravity is 3.2g/cm3, with white or off-white color. The sublimation decomposition temperature under normal pressure is 2450°C, which is able to withstand extreme heat of 2200℃.
It can be used as crucible and firing mold materials for smelting aluminum, copper, silver, lead and other metals. It can also be used as the base material of semiconductor. For example, it could use as heat sink and insulating thermal substrate for semiconductor devices to improve heat dissipation capacity and packaging density of substrate material. It can be used in dual in-line packaging and flat packaging. it could also make into high-frequency piezoelectric components, large scale integrated circuit substrates, etc., such as used on ceramic substrates such as LED lighting.
| Item | Unit | FDLB | ||
| Color | – | grey | ||
| Apparent Porosity | g/cm3 | 3.3 | ||
| Surface Roughness | µm | 0.2~0.3 | ||
| Light Reflectivity | 0.3-0.4mmt | % | 35 | |
| 0.8-1.0mmt | 25 | |||
| Physical Properties | Modulus of Rapture | 3 points bend | MPa | 350~450 |
| Young’s Modulus | GPa | 320 | ||
| Viker’s Hardness | GPa | 11 | ||
| Fracture Toughness | IF method | MPa | 3 | |
| Thermal Properties | Thermal Expansion | 40-400°C | 10-6/K | 4.6 |
| 40-800°C | 5.2 | |||
| Thermal Conductivity | 25°C | w/(m・K) | 180~230 | |
| 300°C | 120~145 | |||
| Specific Heat | 25°C | j/(kg.k) | 720 | |
| Electrical Properties | Dielectric Constant | 1MHz | – | 8.5 |
| Dielectric Loss | 1MHz | 10-3 | 0.3 | |
| Volume Resistance | 25°C | Ω.cm | >1014 | |
| Breakdown Voltage | DC | kv.mm | >15 | |
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